Isy Spence
May 17, 2023

TIEVA Receives the Ingram Micro GCIS 2023 Solution Partner of the Year Award

TIEVA Commercial Director Steve Norman was delighted to announce today that the business had received the Ingram Micro 2023 GCIS 30 Award in the Solution Partner of the Year award category for the Europe, Middle East and Africa region.

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The Ingram Micro team chose their annual conference, Global Cloud & Innovation Summit, in Las Vegas, Nevada to present him with this accolade.

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TIEVA was noted to have displayed extraordinary levels of innovation, advocacy, performance, and sales success in 2022. The Solution Partner of the Year category recognises channel partners who teamed with Ingram Micro to achieve outstanding results for their customers through the delivery of high impact solutions and services.

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Speaking from the USA where Steve was attending the event, Steve said:

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“I am thrilled to receive the Solution Partner of the Year Award for EMEA on behalf of TIEVA. This is a very special accolade as the annual Ingram Micro 2023 GCIS 30 Awards is used as the platform to honour the success of top performing channel partners who have exhibited an elite ability to deliver powerful, digitally transformative solutions with the support of Ingram Micro.”
Steve Norman
Commercial Director

TIEVA delivers the essential business technology products, services, and support, to simplify IT and create more powerful ways to work. From the cloud, to the network, to the device, and beyond. Everything we do is designed to enable secure, seamless connections that enable people to connect, communicate and collaborate without limitations.

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Steve Norman, Commercial Director, receives the Ingram Micro GCIS 2023 Solution Partner of the Year Award, on behalf of TIEVA

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